Wafer Processing
PRP uses state of the art facilities at Rutherford Appleton Laboratory to design, develop and manufacture their own LEDs. They are also able to offer PRP’s extensive skills and experience in this area to customers who require wafer processing.
Features:
- Class 1,000 cleanroom
Photolithography – conventional mask aligner
E-beam direct write
Dielectric deposition – PECVD and sputtered
Metal deposition – thermal, E-beam and sputtered
Lift off
Metal etching (wet and dry)
Mesa etching (wet and dry)
Contact sintering / annealing
Wafer dicing
Metrology and characterisation – SEM, AFM and profiler